Registration Benefits
Register Now!
Purchase Online
 
 
Home > Products by Application > Materials > JEOL CP

JEOL CP


CP Cross Section Polisher






Using an argon beam, the JEOL CP slices and polishes pristine cross sections of the most challenging samples -- composites, low melting point materials, amalgams, and thin coatings.

The CP preserves grain structure, interfaces, and surfaces without deformation so you achieve the truest possible representation of your sample.  The argon beam slices cleanly, leaving no residue.









An Innovative Tool with Patented, Unique, Technology
Developed by JEOL Application Specialists.


A cross section at 90 degrees to the surface of a specimen (JEOL patent)
The cross section polisher (CP), which is supported by the patented technology developed by JEOL, makes a cross section perpendicular to the surface of a specimen. This is suitable for measurement of multi-layered structures.

Clean polished cross section of almost any material in simple steps
The CP can prepare a perfect cross section from almost any material such as;
  • Difficult-to-polish soft materials such as copper, aluminum, gold, solder, and polymer,
  • Difficult-to-cut hard materials such as ceramic and glass, and
  • Composite of these materials.
The cross section prepared by the CP is suitable for EDS, WDS, Auger, and EBSD (Electron Back Scatter Diffraction) analysis, and for observation and measurement of multi-layered structures.

Preservation of internal structures
The CP preserves structures, which the conventional mechanical polish would destroy, such as voids in a bonded interface between gold wire and bonding pad. Adhesion between plated layers, or between solder and metal, can be observed and analyzed accurately. The perfect cross section is suitable for analysis of precipitates as well.

Compared with FIB
Damage to a specimen during polishing is much less compared to FIB preparation due to the use of an argon ion beam. The CP can make a large cross section surface with up to 1mm width.

No skill needed
Making a surface of soft materials by mechanical polish or a microtome requires many years of experience. The CP readily lets you make a perfect cross section after minimal practice.

Note: This unit is represented by Boeckeler Instruments only in the United States.


Table of Applications


Click on any of the following links for visual examples of CP output:
Application to SEM
Granular Medicines
Application to SEM
Paper
Application to SEM
Gold Wire Bonding
Application to SEM
Ceramic Particles
Application to SEM
Super Conductive Wire
Application to SEM
Chip Resistor
Application to EPMA
Lead-free Solder
Application to EBSD
Card Edge Connector
Application to Auger
IC



Specifications


Accelerating voltage 
2 to 6 kV
Ion beam diameter 500µm (FWHM)
Milling rate 1.3µm/min (6kV, silicon, 100µm from edge)
Maximum specimen size 11mm(W) x 10mm(D) x 2mm(H)
Specimen stage movement X: ± 3mm, Y: ± 3mm
Specimen alignment
± 5°
Gas Argon
Pressure measurement Penning gauge
Pumping system TMP, RP
Dimension and weight

Basic unit
380mm(W) x 570mm(D) x 520mm(H), 41kg
Rotary pump
120mm(W) x 280mm(D) x 170mm(H), 10kg

Installation requirements
Power Single phase AC 100V, 50 or 60Hz, 0.4kVA
Grounding 100 ohms or less
Argon gas Pressure: 0.15MPa (1.5kg/cm2)
Dry argon, 99.9999% or more purity
(Argon gas, gas cylinder and regulator would be provided by customer.)
Room temperature 20  ± 5°
Humidity 60% or less

Copyright © 2008 Boeckeler Instruments. All rights reserved. Functional Design and Architecture Copyright © 2008 Chapman Net Systems, Inc.. All rights reserved.
    Login
     Contact        Sitemap